Highcon And LxBxH Host VIP Event

Highcon and LxBxH in Switzerland hosted a VIP event in April, following the recent launch of the Highcon Euclid IIIC digital cutting and creasing machine for corrugated board. This unique Highcon Engage event introduced the potential of digital finishing to a wide variety of visitors from eight countries who came to learn about the real-life experience of LxBxH using the machine.
Over 70 people attended the event, which included a live demo on the Highcon Euclid IIIC machine, an introduction by Aviv Ratzman, Highcon CEO and Co-Founder, and a presentation by Silvano Gauch, President of LxBxH, describing his daily work with the technology.
Gauch said, ‘We took a close look at where the market is going and one important point was that our batch size was actually declining over the years. Also, in our factory, more than a third of our orders are Just-in-Time delivery, which means we produce, keep in stock and wait for the customer to need something. The third trend is towards more complex packaging–more die-cutting, less inline boxes.’
He added, ‘In order to solve these issues, I wanted to move to Just-in-Time production and that was our objective in looking at the machine.  The Highcon Euclid solved our problems and met our objectives.’
During the event, two jobs were run on the machine – a 2-up E-Flute wine box and a 1-up B-Flute inner tray in B1 format – demonstrating the extent that the Euclid reduced setup time and aided productivity. Guests were also given a specially designed chocolate box produced on the machine.
Ratzman said, ‘We were overwhelmed with the response we received to this first of a series of Highcon Engage VIP events that we are holding in Europe and the Americas. We believe that there is no better testament to the capabilities of our technology than the praise we have received from customers and we are proud to have them describe the benefits our products have brought to their business.’
Corrugated packaging converters can also learn more about the Highcon Euclid IIIC machine at FESPA in Berlin from 15-18 May, where Highcon will be exhibiting for the first time. 
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