Robatech’s new SpeedStar Compact jetting head is one of the fastest and most compact application heads on the market for high-precision, hot melt adhesive applications. Its features provide added value to the packaging, converting and graphic industry.
With up to 800 switching cycles per second, it enables very small bead and dot application for particularly demanding and clean gluing applications at high production speeds. The smallest installation dimensions, speed and high-precision hot melt adhesive application over the entire service life makes Robatech’s new application head ideal.
Robatech integrated an automatic stroke adjustment to ensure that the electromechanical jetting head can maintain the precision in adhesive application over the entire service life of approximately 500 million operating cycles. Manual readjustments are no longer necessary and maintenance-related interruptions are reduced.
However, SpeedStar Compact has a lot more to offer. Compared to its predecessor SpeedStar Diamond, the new electric head has been technically optimised in terms of hardware and is therefore more durable. As the electronic unit is detached from the head, SpeedStar Compact is also 46mm smaller.
With the new design, Robatech considers the limited space available in the industry. Space-saving integration into systems and entire machines becomes possible for the customers. The higher protection class IP55 allows better use in wet areas. SpeedStar Compact is now available as a single and multi-head in a short or long version.